Part Number:LM22675
Dear support member,
My customer use LM22675.
I have a question about line reguration.
Daimen is a 3 phase power supply,
The input voltage fluctuates at intervals of 8 ms at 0.1 V.
The output voltage fluctuated at intervals of 8 ms at 50 mV.
Is this normal behavior of IC?
If it is not normal operation,would you teach me the reason?
Specification condition
Vin: 27 V
Vout: 5 V
Iout: 1A
Best regard.
Bob Lee
Part Number:TAS5825M
Hi support team,
We would like to know what is the idle current of the amplifier with different PVDD ( 7.4V to 20V ) and with different speaker load ( 4 to 8 ohm ). it is because the specification did not mention in detail.
Beast regards
Kelvin Lo
Part Number:CC2640R2F
Tool/software:TI-RTOS
Hey,
We've just started looking into using a CC2640R2F module instead of our current CC2650 one and are having issues with reliably running your example code. We notice strange behaviour during boot that is always related to the radio driver, RFCC26XX_singleMode.c. We're using simplelink_cc2640r2_sdk_1_50_00_58 and have tried both simple_np and simple_peripheral, but everything I mention below is from our simple_peripheral test.
We are using a ZB7412 module which has a 32 kHz external oscillator and CC2640R2F 5x5mm RHB VQFN32 package. I build the code with CC2650R2DK_5XD defined and then had to modify source\ti\blestack\target\board.h and change the include because cc2650r2em_board.h does not exist.
//#include "./cc2640r2em/cc2640r2em_board.h" #include "../boards/CC2640R2DK_5XD/CC2640R2DK_5XD.h"
During boot the device will either work and begin advertising, or we get a BUSFAULT. It seems to occur randomly with roughly equal frequency. I enabled some exception decoding and see the error in ROV:
Hard Fault: FORCED: BUSFAULT: PRECISERR.Data Access Error. Address = 0x400c8000
The ROV helpfully tells me that it occurred during a Swi with handle 0x20001554. Unfortunately the ROV doesn't know about this Swi, but looking in my memory map I see that starting from 0x20001498 I have the .bss segment for RFCC26XX_singleMode.obj for 0x2a8 bytes. Open that in the memory bowser, and we see the relevant Swi is swiFsm whose function is swiFxnFsm.
Now, I don't know what exactly how the radio driver works, or what's relevant, but I'll describe what I think its relevant state is:
nClients = 0x01; bRatSyncWasRequested = true; bRadioHasBeenBootedBefore = false; bRadioIsActive = false; bRadioIsBeingPoweredUp = true; bRadioIsBeingPoweredDown = false; bRadioYieldingWasRequested = false; bRadioYieldingWasCancelled = false; bRadioDelegateXOSCHFSwitching = false; pCurrClient = 0x20004988 (rfObject); pFsmState = 0x6Fa5 (fsmPowerUpState);
I can't get a usable stack trace, so not sure where exactly it's gone wrong. However, LR = 0x10001d2b and PC = 0x10001d30, but I can't find anything in that range within my memory map. I'm assuming that it's a ROM address, but really have no idea. Stack starts at 0x20004000, is 0x400 long and current SP = 0x20004330.
I've copied the exception context below:
$addr N/A $type ti.sysbios.family.arm.m3.Hwi.ExcContext threadType Swi threadHandle 0x20001554 threadStack 0x20004000 threadStackSize 0x400 r0 0x0 r1 0x2 r2 0x400c8000 r3 0x1c r4 0x400ca036 r5 0x2 r6 0x7f r7 0x0 r8 0x0 r9 0x2 r10 0x20004d2c r11 0x0 r12 0x20004d2c sp 0x20004330 lr 0x10001d2b pc 0x10001d30 psr 0x41000000 ICSR 0x414803 MMFSR 0x0 BFSR 0x82 UFSR 0x0 HFSR 0x40000000 DFSR 0x0 MMAR 0x400c8000 BFAR 0x400c8000 AFSR 0x0
Going through my map, 0x20004d2c = rfSetup. Could just be junk in the registers, but rfSetup is the command that was executed via RF_runCmd. I can see that when it crashes, its status is always 0, which I believe is RFSTAT_IDLE and implies the command didn't get around to executing before it crashed (note: it WAS scheduled and I can see this if I break in RF_runCmd). I have also noticed (in simple_np) that this CMD_RADIO_SETUP will sometimes start (status=2) but not finish, which results in ICall_abort being called during gapRole_init because osal_snv_read(BLE_NVID_IRK, KEYLEN, gapRole_IRK) times out.
I hope that gives someone knowledgeable in this code enough information to figure out what may be going wrong, any help is much appreciated.
Thanks
Campbell
Part Number:BQ24123
Hello,
I'm working on a design that has a BQ24123 on it, and on the opposite side is a large SMT connector that prevents me from putting nice GND vias under the center pad. So right now there are no vias under the pad, they're all about 100mil away from the package. Board is 10 layer, with GND on layer 2 (beneath top) and also on layer 7 & 9. So I was thinking that one way to fix this would be to use blind vias from top layer down to the GND plane right below. Would this be helpful? In the existing design (with gnd vias 100mil away) the charging current has to be reduced in order to pass emissions. Would using blind vias beneath the center pad reduce emissions?
Also, if we do use these blind vias to GND beneath the pad, should they be tented?
Part Number:LAUNCHXL-CC26X2R1
I am familiar with a variety of TM4C123 chips. For these chips there is ROM.
And..
Tiva™ C Series TM4C123x ROM User's Guide, UG-ROM-TM4C123x-818, SPMU367. 347 pages.
Most of the above book mimics the TivaWare calls.
I am trying to find a similar guide for the CC26X2R1. The devices Technical Reference Manual, SWCU185, contains sections on ROM. But they seem very incomplete. In fact this is the entire section:
The ROM contains a serial bootloader with SPI and UART support (see Chapter 10) as well as a Driver
Library and an RF stack support. For details, see Section 5.6.
But chapter 8.7 describes ROM functions, but the description does not seem to fill up to 256KB ROM. Is the driver library basically TivaWare? For the RF stack, does this include both BLE 5.0 AND 802.15.4?
Is there a reference on what is in this device's ROM? If so, where? If not, when?
Part Number:AM3354
I am trying to get a NAND part programmed before installation on a AM3354-based baseboard.
The vendor has had trouble duplicating the AM335x ECC algorithm on their NAND programmer. They were using the bin2nand source code (provided by TI) as a reference.
After all that, however, I realized that I may be able to use the bin2nand application to create an image file they can just write to the NAND directly.
I have four image files to put on the NAND: MLO, u-boot.img, uImage (Kernel), and ubi.img (Filesystem). I am able to flash these files to the NAND from Linux using the standard nandwrite/flash_erase utils.
Given this, what is the best approach to using the bin2nand tool to create a NAND image that has ECC data that is compatible with the AM3354 hardware (BCH8)? Do I need to dump the entire NAND to a single file and process that? Do I need to use a TI version of nand2bin to accomplish this? Should I create an image for each partition separately using bin2nand on each of the four image files?
Thank you for any guidance or suggestions before I have to fully reverse engineer the source code.
The NAND is partitioned (via the kernel) as (SZ_256K = 0x40000) :
{
.name = "MLO",
.offset = 0, /* mtd1 Offset = 0x0 */
.size = SZ_256K,
},
{
.name = "MLO.backup1",
.offset = MTDPART_OFS_APPEND, /* mtd2 Offset = 0x40000 */
.size = SZ_256K,
},
{
.name = "MLO.backup2",
.offset = MTDPART_OFS_APPEND, /* mtd3 Offset = 0x80000 */
.size = SZ_256K,
},
{
.name = "MLO.backup3",
.offset = MTDPART_OFS_APPEND, /* mtd4 Offset = 0xc0000 */
.size = SZ_256K,
},
{
.name = "U-Boot",
.offset = MTDPART_OFS_APPEND, /* mtd5 Offset = 0x100000 */
.size = 8 * SZ_256K,
},
{
.name = "U-Boot Env",
.offset = MTDPART_OFS_APPEND, /* mtd6 Offset = 0x300000 */
.size = 1 * SZ_256K,
},
{
.name = "Kernel",
.offset = MTDPART_OFS_APPEND, /* mtd7 Offset = 0x340000 */
.size = 20 * SZ_256K,
},
{
.name = "File System",
.offset = MTDPART_OFS_APPEND, /* mtd8 Offset = 0x840000 */
.size = MTDPART_SIZ_FULL,
},
NAND Part: MT29F4G08ABAEAWP:E
Datasheet: www.micron.com/.../mt29f4g08abaeawp
Part Number:LAUNCHXL-F28027
Tool/software: Code Composer Studio
In most PWMdriver used in the Digital Power Library like PWM_DualUpDwnCnt_CNF(int16 n, int16 Period, int16 Mode, int16 Phase), what is that "n" referring to?
I am using BOOSTXL-C2KLED (C:\ti\controlSUITE\development_kits\C2000_LaunchPad\f2802x_examples\LED_Boost_PC) and in the code, the PWM setup is (LED_Boost_PC_Main.c):
PWM_DualUpDwnCnt_CNF(1, prd, 1, 0);
PWM_DualUpDwnCnt_CNF(2, prd, 0, 400);
PWM_1ch_UpDwnCnt_CNF(3, prd, 0, 400);
while in the ISR (LED_Boost_PC_ISR.asm), it is:
PWMDRV_DualUpDwnCnt_INIT 1 ; EPWM1AB
PWMDRV_1ch_UpDwnCnt_INIT 2 ; EPWM2A
The docs in C:\ti\controlSUITE\libs\app_libs\digital_power\f2802x_v3.5\Doc\DPLib.pdf doesn't explain this in detail.
regards,
Victor
Part Number:TMS320F28375D
Hi champs,
I have a question about EMIF2 16bit memory interface.
On TRM P.2612
-------------------------------------------------
The EMIF address pin EM1A[0] always provides the least significant bit of a 32-bit word address. Therefore, when interfacing to a 16-bit or 8-bit asynchronous device, the EM1BA[1] and EM1BA[0] pins provide the leastsignificant bits of the halfword or byte address, respectively.
-------------------------------------------------
This is for EMIF1.
When it uses EMIF2,
-------------------------------------------------
The EMIF address pin EM2A[0] always provides the least significant bit of a 32-bit word address. Therefore, when interfacing to a 16-bit or 8-bit asynchronous device, the EM2BA[1] and EM2BA[0] pins provide the leastsignificant bits of the halfword or byte address, respectively.
-------------------------------------------------
As above, is my understanding correct?
Does it work correctly when connected as follows?
Delfino Asynchronous
EM2A[0] ADR[0]
EM2A[1] ADR[1]
-
-
-
EM2A[12] ADR[12]
Regards,
Shinji Ueda
Part Number:TPS53353
Hello Team
Our customer measure the VFB voltage and the value is about 0.62-0.63V. But the typical is 0.6V. Could you give some comment about it?
Part Number:TPS543B20
Hi,
Could you tell me about TPS543B20 Feedback loop?
Customer made an evaluation following conditions.
Obviously characteristics (Phase characteristics etc..) are different between the two output voltage setting method.
Please tell me the difference in behavior between using VSELL and using FB resistors.
I want to know the difference of internal control and information of mode change.
Best Regards,
Yusuke / Japan Disty
Part Number:TLV320AIC3204
Hi Sirs,
Sorry to bother you.
We have finished TLV320AIC3204 schematic as below.
Could you help double check it?
Any suggest is welcome.
Thanks!!
Schematic:
(Please visit the site to view this file)
Part Number:SN65HVDA100-Q1
Hi,
Let me question the LIN terminal of SN65HVDA100QDRQ1.
As a result of analyzing with a problem, EOS of the LIN terminal was reported.
So, let me ask you the question below.
1. Is the LIN pin (6 pin) protected with an ESD diode?
2. The LIN pin has ± 12 kV ESD immunity.
Therefore, it is not necessary to connect an ESD diode separately to the device.
Do you think there is no problem?
(* Is it necessary to connect TVS separately at the system level?)
best regards
Part Number:LAUNCHXL-CC26X2R1
I am using the LAUNCHXL-CC26X2R1 to evaluate how easy it would be to use it for 802.15.4 applications.
I found the collector_2_4g_cc26x2lp project.
Is C:\ti\simplelink_cc26x2_sdk_2_10_00_44\docs\ti154stack\html the best source for instruction/background understanding what collector_2_4g_cc26x2lp does?
Are there any videos on 15.4 on this launchpad?
Part Number:WL1801MOD
Hello,
My customers have several questions for the INI file and wl18xx-conf.bin on WL1801MOD.
They think they need to set the same settings as the settings for TELEC (MIC) certification.
1.Would you share the INI file for TELEC (MIC) certification?
2.What is the source INI file to generate default wl18xx-conf.bin in AM335x's SDK?
Best Regards,
Nomo
Part Number:TDA3MV
Hi expert,
Customer put order on XTDA3SXXBABFQ1, but i'm not sure this part contain MCAN module, could you please help to check ?
Thank you.
Regards,
Allen
Part Number:AFE4405
Hi all,
I am doing a project with AFE4405, can you send me a project code on AFE4405EVM?
Thank you