Part Number: DRV8812
Hello team,
Could you please clarify the pros/cons for the mixed delay mode of DRV8812?
Best regards,
Iwata Etsuji
Part Number: DRV8812
Hello team,
Could you please clarify the pros/cons for the mixed delay mode of DRV8812?
Best regards,
Iwata Etsuji
Part Number: DRV8812
Hi team,
Can we expect the self-recovery behavior from any fault condition such as OCP with connecting nFAULT pin and nRESET pin?
Best regards,
Iwata ETsuji
Part Number: LAUNCHXL-CC1352P
I have a device acting as a central device, which is running a modified version of the TI multirole from simplelink_cc13x2_26x2_sdk_3_20_00_68 SDK. I then have a few other devices running simple peripheral from the same SDK which I am trying to connect to. I have a BLE GATT service defined which lets me trigger the GAP scan just as you would have from the original two-button menu on the central device
When I do the scan I get this type of result
stdin = scan
Discovering...
Discovered: 0x806FB0296C55
Connecting
1 device discovered
Connected to 0x806FB0296C55
Num Conns: 2
0x806FB0296C55 is disconnected
Num Conns: 1
I'm triggering my connection off of the 'EVT_ADV_REPORT' event, when testing without pairing I have been able to get a connection sometimes, but when pairing is enabled I lose the connection always.
case BLE_EVT_ADV_REPORT: { GapScan_Evt_AdvRpt_t* pAdvRpt = (GapScan_Evt_AdvRpt_t*) (pMsg->pData); if (ble_findSvcUuid(SIMPLEPROFILE_SERV_UUID, pAdvRpt->pData, pAdvRpt->dataLen)) { ble_addScanInfo(pAdvRpt->addr, pAdvRpt->addrType); DOUT("Discovered: %s", Util_convertBdAddr2Str(pAdvRpt->addr)); ble_connect(pAdvRpt); } // Free scan payload data if (pAdvRpt->pData != NULL) { ICall_free(pAdvRpt->pData); } break; }
my BLE connection function looks like this
void ble_connect(GapScan_Evt_AdvRpt_t* pAdvRpt) { GapScan_disable(); DOUT("Connecting\n"); GapInit_connect(pAdvRpt->addrType & MASK_ADDRTYPE_ID, pAdvRpt->addr, INIT_PHY_1M, 0); }
I'm not sure if I am going about this the wrong way or if there is something else that needs to be done in order to have established and paired connections. I tried to implement this similar to how others on the forum did as well as how the ble_examples from GitHub went about this, although they don't account for pairing.
Thanks in advance
Part Number: LM5008
Tool/software: WEBENCH® Design Tools
Hi,
Greetings.
Our customer tried to design in Webench using the PN LM5008MM/NOPB. When they are reviewing the design detail they noticed that the Theta_JA for the IC has a different value than the value on the datasheet.
For the DGK (VSSOP) package, it is stated in the datasheet that it was 139.7°C/W however on Webench it was 40°C/W. I've attached an image below highlighting the difference.
They want to know if which one is correct. I think they should follow the datasheet information.
Can you please verify which one is the correct value?
Any help for this matter is much appreciated.
Thank you and have a great day.
Regards,
Cedrick
Part Number: CC2541
Hello,
Our CC2541 device works as a periperal but Connection with a certain smart phone like Google Pixel3 fails sometimes.
Connection succeeds 9 times of 10 attempts generally . Encription is enabled in these connections.
When connection fails, TI's SDK returns LL_STATUS_ERROR_CONN_TIMING_FAILURE during SMP proceedure.
We can observed "Identity Information" of SMP message from air log , but its sequence seems to stop due to LL_STATUS_ERROR_CONN_TIMING_FAILURE occurrence.
What is possible reason of this connection failure ?
BR, Nobu
Part Number: SN65HVD1470
Hi experts,
Written on the data sheet
[7.8 Switching Characteristics — 400 kbps]
[tr, tf Driver differential output rise/fall time]
100ns(min)/750ns(max)
For example, tr = 100ns, tf = 750ns?
Will it be a different value?
Or is it the same when tr = 100ns and tf = 100ns? ,
tr = 750ns and tf = 750ns?
Best Regards
Part Number: AM3358
Hi sir
i am new to the Beaglebone Black board, here i have a doubt on booting types...
1) i have check the new board kernel version 4.1.xx
2) after that i have boot-up with micro SD card with this Debian 9.9 2019-08-03 4GB SD LXQT image file, it is booted good and its contains kernel 4.14.xx (checked :uname -r)
3) later i have booted with (prebuild kernel images from:https://github.com/niekiran/EmbeddedLinuxBBB/tree/master/pre-built-images/serial-boot)serial UART
as like this: https://www.youtube.com/watch?v=3y1LMNPoaJI it's also booted fine and i get in to this:root@am335x-evm:~# uname -r
here also i have check kernel version 3.8.xx up to here it's good, and i shutdown the board exit the terminal.
4) when i again check the board it contains previous kernel version of 4.14xx . why it's like this
could you clarify me.
Thanks
Harish
Part Number: TPA2017D2
Part#: TPA2017D2RTJRPart Number: BQ35100
Hi
We now have a new project which uses 1S3P ER18505(Li/SOCl2)+SPC1550(Capacitor) as the system power. And in order to evaluate the remaining charging, we used the BQ35100 to realize the purpose.
But we found the following issues when we using the demo board(EV2400+BQ35100EVM-795):
1. As the document"Going to Production With the bq34z1xx " mentioned as below, writing the data flash image is needed for BQ34z1xx,
Is the same step for BQ35100 before calibration? If yes, could you help to provide the data flash image for me? and can we push this file to BQ35100 after mounted on PCB board by other method?
2. Our system contains many ICs except the BQ35100, in order to ensure the BQ35100 can work, could you help to confirm what's the necessary steps before mounting this IC on the PCB?
Part Number: DP83822IF
Hi team,
About the MAC interface mode of DP83822, the datasheet says the device can work at RMII master or slave mode. However, it seems we can only select enable or disable RMII mode through pin strap. The datasheet does not say how to select master or slave mode.
Also, as my understanding, the device can only works in RMII master mode if the reference clock is generated from 25MHz crystal, and It can work in master or slave mode if it is clocked by 50MHz oscilator. correct?
Thank you,
John
Part Number: AM6548
Hello TI,
We are working on a custom platform based on the TI's AM6548 reference platform TMDX654GP EVM.The software is based upon the latest release from Texas instruments PROCESSOR-SDK-LINUX-AM65X 06_00_00_07.
In reference code base dts file has the configuration for PRG2 ethernet(Dual Ethernet application node on PRU-ICSSG2). We did not modify any code.
eth1 and eth2 are working fine until we bind them.
We tried to achieve dual mac mode(active backup bonding). we configured the bonding driver as module and inserted the module in the kernel using insmod.
We followed the steps mentioned in the Dual mac mode section (software-dl.ti.com/.../Foundational_Components_PRU-ICSS_PRU_ICSSG.html
While binding the two PRU-ICSS Ethernet ports to the bond0 interface we are facing the following error.
root@am65xx-evm:~# [ 146.048250] ------------[ cut here ]------------
[ 146.052889] NETDEV WATCHDOG: eth1 (icssg-prueth): transmit queue 0 timed out
[ 146.060007] WARNING: CPU: 3 PID: 0 at net/sched/sch_generic.c:461 dev_watchdog+0x29c/0x2a8
[ 146.068254] Modules linked in: bonding rpmsg_proto virtio_rpmsg_bus ti_am335x_adc kfifo_buf dwc3 xfrm_user udc_core xfrm4_tunnel tunnel4 ipcomp xfrm_ipcomp esp4 ah4 a
f_key xfrm_algo icssg_prueth pru_rproc crc32_ce crct10dif_ce pruss irq_pruss_intc ti_k3_r5_remoteproc remoteproc pvrsrvkm(O) ti_am335x_tscadc pruss_soc_bus sa2ul omap_rn
g rng_core authenc phy_omap_usb2 dwc3_keystone sch_fq_codel cryptodev(O) ipv6
[ 146.104525] CPU: 3 PID: 0 Comm: swapper/3 Tainted: G O 4.19.38-g4dae378bbe #1
[ 146.112942] Hardware name: Texas Instruments AM654 Base Board (DT)
[ 146.119111] pstate: 20000005 (nzCv daif -PAN -UAO)
[ 146.123893] pc : dev_watchdog+0x29c/0x2a8
[ 146.127895] lr : dev_watchdog+0x29c/0x2a8
[ 146.131892] sp : ffff00000806fd80
[ 146.135196] x29: ffff00000806fd80 x28: 0000000000000005
[ 146.140500] x27: ffff80084016ca80 x26: 00000000ffffffff
[ 146.145802] x25: 0000000000000140 x24: ffff8008467d4440
[ 146.151106] x23: ffff8008467d441c x22: ffff800845e46680
[ 146.156408] x21: ffff000008c11000 x20: ffff8008467d4000
[ 146.161711] x19: 0000000000000000 x18: 0000000000000010
[ 146.167014] x17: 0000000000000000 x16: 0000000000000000
[ 146.172317] x15: ffffffffffffffff x14: ffff000008c13648
[ 146.177620] x13: ffff000088cc68a7 x12: ffff000008cc68b0
[ 146.182923] x11: ffff000008c29000 x10: ffff00000806fa80
[ 146.188225] x9 : 00000000ffffffd0 x8 : ffff0000084b9260
[ 146.193528] x7 : 6575657571207469 x6 : ffff80087fb017e0
[ 146.198831] x5 : ffff00000840b770 x4 : 0000000000000008
[ 146.204134] x3 : 0000000000000004 x2 : 0000000000000040
[ 146.209437] x1 : be457ce7715cd800 x0 : 0000000000000000
[ 146.214739] Call trace:
[ 146.217182] dev_watchdog+0x29c/0x2a8
[ 146.220842] call_timer_fn+0x20/0x78
[ 146.224410] expire_timers+0xa8/0xb8
[ 146.227977] run_timer_softirq+0xa4/0x190
[ 146.231979] __do_softirq+0x10c/0x208
[ 146.235635] irq_exit+0xb8/0xc8
[ 146.238771] __handle_domain_irq+0x64/0xb8
[ 146.242857] gic_handle_irq+0x7c/0x178
[ 146.246596] el1_irq+0xb0/0x128
[ 146.249731] arch_cpu_idle+0x10/0x18
[ 146.253300] do_idle+0x128/0x140
[ 146.256521] cpu_startup_entry+0x20/0x28
[ 146.260436] secondary_start_kernel+0x148/0x158
[ 146.264955] ---[ end trace 9a08eee7263cd65f ]---
[ 146.269580] icssg-prueth pruss2_eth eth1: xmit timeout
[ 148.513573] icssg-prueth pruss2_eth eth2: Link is Up - 1Gbps/Full - flow control off
[ 148.524627] bond0: link status definitely up for interface eth2, 1000 Mbps full duplex
[ 152.192261] icssg-prueth pruss2_eth eth1: xmit timeout
Please find the attached minicom logs and base-board.dts files.
(Please visit the site to view this file)(Please visit the site to view this file)
1.Does SDK-06_00_00_07 supports active backup bonding?
2.Could you point us what we are missing?
Thanks and Regards,
Johni
Part Number: LM5170EVM-BIDIR
Hello:
Now in my project, I will use the Lm5170 output(use buck mode,the output voltage is about 12V) to control a product. In my test, I use the DCDC output to connect the product, work is normal. Then I close the contactor(this contactor is in the product), then the phenomenon is: the contact is closed,but later it is open. I think it will be output current limitation. How can I enhance the output current? Now I see when it is closed, the voltage changed is normal. Or I want to use this way, how can I use it? I want to check my use way is right or not.Could you please help me check it? Thank you very much! I will wait for your reply!
Sir,
While implementing RNDIS over USB, I found that after the initialization the DATA_PACKET is not receiving in the device. As seen in the wireshark log, host is sending the data_packet as URB_BULK_out.
After receiving this data_packet, a response should be given. But by debugging it i came to know that it is not receiving in the device. I'm using USB CDC device.
What could be the reason for data not receiving in the device side?
I'm also attaching wireshark log of my device with this message.
Part Number: BQ24401
Hi,
We've had a 6S NiMH charge circuit designed externally using the BQ24401. As far as I can tell, the circuit matches that in Figure 7. of http://www.ti.com/lit/ds/symlink/bq24401.pdf with the VBAT resistor divider changed to match our 6 cell battery pack.
For the most part, the circuit works fine, however about 20% of the time it will exit fast charge early after less than an hour. From the datasheet, fast charge is only exited from timeout, the battery being too hot, or the battery temperate rate of change exceeding -Vcc/161.
Our MTO is set to 5.5hrs, so it shouldn't be terminating from timeout.
Our Vcc = 5V, so the temperature cutoff is 0.225*5 = 1.125V. In all cases of the early charge termination, Vts has been around 1.6V, so it shouldn't be terminating from the battery being too hot.
Finally, I've recorded Vts using an external ADC at 1Hz and have seen the temperature rate of change be far from the limit. A plot of this is below. The low spikes in the plot are an artefact of the ADC I'm using and they do not appear on an oscilloscope. Similarly, the early termination happens with and without the external ADC connected, so the ADC connection is not the cause.
I've also added a filter circuit on Vts as shown in Figure 11 of http://www.ti.com/lit/an/slua064b/slua064b.pdf. This change made no difference.
As far as I can tell, there's no reason it should be terminating fast charge early, so any help or advice would be appreciated.
Thanks,
Luca
Part Number: BQ25713
Hi
My customer use BQ25713 design the schematic. I2C has set the maximum and minimum charging voltage and the maximum charging current, but the actual running current is higher than the maximum current? At this time the board is very hot, My input voltage is 12V.
Attached the schematic for your reference.
Waiting for your reply.
Thanks
Star
Part Number: LM358
Dear team,
My customer wants to use LM358 with MSP430AFE253. The following is the circuit
After using TLC2272, the measured data jitter is very large, but the high-precision multimeter test follows the output but is very stable.
BR,
Susan
Part Number: SN74LV165A
if SER is not pull down, will it influence output data?
Part Number: CC2640R2F
hi,
i can't find the RF power setting API in simplelink SDK, where to find it?