Hi TI,
I just need a quick answer regarding the association table in TI ZigBee chips.
I have a good understanding of Neighbour Table of a routing device. But I'm quite confused between the Neighbor Table and Association Table mentioned in some PDF documents of CC253x chips.
Hope you can clarify this!
I have a 3.7vDC single cell LiPO that is capable of getting charged @ 20mA and I would like to use anycharger that throws 0.5amps to 2amps @5vdc to 6vdc max, what setting in the register's is recommended? (given I have TS connected to voltage divider as suggested in the datasheet to disable TS)
Dear Spacialists,
My customer is considering TDC7200 for LIDAR.
He has question about multiple reflected signal measurement.
Could you please advise?
(1) The datasheet of P1. says "supports up to 5 signals",
He thinks this means multiple reflected signal.
On the other hand, datasheet P.5, 7.3 recommended Operating Conditions of Minimum Time between 2 stop signals, describes minimum 67ns.
In case of LIDAR, 67ns means 3 x 10^8 x 67 x 10^(-9) = 20.1m.
TDC7200, when using multiple optical reflection, can't it measure less than 20.1m?
(2) Do you have any solution for reducing minimum time between 2stop signals 67ns?
If it can't be impossible, it seems to be not suitable for LIDAR.
I appreciate your great help.
Best regards,
Shinichi
Hi,
My customer has a question about PCIe inbound address translation in RC with 64bit mode. In this case, BAR0/1 are dedicated to address space 0. So if an external device (FPGA) needs to initiate the transfers to DSP's memories, other BARs pair has to be configured to route PCIe access to DSP memories, but the problem is that RC only supports BAR0/1. Any other BARs are available.... Do you have any way to realize inbound access to DSP memories in 64bit mode ?
Best Regards,
Naoki
Hi
It is difficult to purchase of the PGA450 is used in EVM sensor (manufactured by MURATA),
Is there a product that there is a proven track record in other manufacturers or parts?
It is difficult to purchase of the PGA450 is used in EVM sensor (manufactured by MURATA), Is there a product that there is a proven track record in other manufacturers or parts?
Team,
ZTE is using TCA8418 as the key board application for the handset. They are reporting the FIFO error issue:
1. Read registers, all the register value are normal, and FIFO is empty;
2. Continue press the button, sometime it will report a wrong button value. And the wrong button value is always the previous pressed button, not the currently pressed one.
3. They are using the trace to debug it, add the break point. they found when the button was released, I2C transmit data is the button value of the previous press.
So they think it is a FIFO error, how to solve it?
They had removed all the capacitors from the row to ground.
Best Regards,
Peter Wei
Dear sir,
I am working with the example "aic3106_loop_linein" standard program.
i have added
evmomapl137_gpio.c
evmomapl137_i2c.c
evmomapl137.c.
please see my code and assists me...........as i dint get any reply from old post.(Please visit the site to view this file)
Hi,
I got a question about advisory 1.1.19 in AM3517/05 Sitara ARM Microprocessors Errata from my customer. I found it seemed same as errata 657417 of ARM A8 when I searched it in other website. The website says errata 657417 is corrected r1p7. Revision 1.0 and 1.1 of AM3517/05 are used r1p7. But advisory 1.1.19 says this issue is affected 1.0 and 1.1 of AM3517/05. So I'm confused it. Could you please tell me why advisory 1.1.19 is sill on errata?
Regards,
M.Ohhashi
Hi Team
Does TI TPS65982 have support TCPC ? intel and HP need check this function.
Hello,
I'm using CC3100 Booster pack with MSP432 Launch Pad. I'm using modified "email" example from CC3100SDK. I would like to operate of a two AAA batteries, but the system stops sending the email when the power supply voltage is at 2.9v or lower. Per the current monitoring, it looks like the MSP432 Launch Pad works and tries to send the email but the CC3100 won't actually perform the operation and the current remains at 50-80mA level. At 3V, the current peaks at 130mA and drops to 50mA and eventually drops back to 80uA after the email is sent. Per the CC3100 datasheet the WIFI chip should be able to work down to 2.1v. Is it feasible to operate this setup of the two AAA batteries?
Thanks,
Alex
Hi Team
I have 2 question for DS90UH948
1 : If we need use HDCP function , How abour the HDCP data put in MUC or EEPROM ?
2 : What is back channel function ? What time we need use this function?
Hi Team,
I have a question about TCA9517 power supply requirement VCCA < VCCB which listed in the datasheet.
[Question]
Please advise us if user could use TCA9517 in the condition of VCCA > VCCB.
I've found some information in the following post.
https://e2e.ti.com/support/interface/i2c/f/390/p/266001/933222#933222
> The TCA9517 is powered off of the VCCB rail and the VCCA rail is just used as a reference level for the A inputs.
> This is why we always recommend that VCCB (main supply voltage) is higher than the VCCA side.
From this post, I understood that VCCA is only used as a reference level and VCCB is the power for the IC. In this case, I think VCCA < VCCB is not a must power requirement. I believe the device could be used as long as VCCB is higher than 2.7V.
Datasheet "Recommended Operating Conditions" does not show VCCB to be higher than VCCA.
Best Regards,
Kawai
hello
I have two TSW14J56 boards which Im currently controlling from two laptops to create a tx pattern + rx capture solution
1. laptop1 - TSW14J56 + DAC (TSW38J84)
2. laptop2 - TSW14J56 + ADC (ADC12J4000)
I just have a simple query - is it possible to control all four boards (TSW+DAC, TSW+ADC) from a single laptop? From what Ive seen, I am unable to start two stand-alone versions of the HDSC Pro GUI on a single laptop so I suspect this is not possible? (USB 3.0 ports access is not the issue, just running multiple instances of the GUI on one PC to control multiple TSW14J56?)
Another quick query is to do with controlling the RF target frequency of the TSW38J84 via the Automation DLL (I run a Matlab script to set the Tx). Is there a command to set the RF frequency of the board? I can set the DAC settings (DAC data rate etc...) but I can find a command in the "HSDCPro Automation DLL User Guide" to control the RF target frequency? Can this only be controlled manually via the TSW38J84 GUI itself?
Any info greatly appreciated.
Marc
hi,
I feel that ek-tm4c1294xl is more used compared to dk-tm4c129x.
The major difference is in the mcu involved.
The cost factor aside, tm4c129xnczad has crypto hardware accelerators and tm4c1294ncpdt doesn't.
I am building an iot application, would this security aspect play a key role? Or would it suffice if i used tm4c1294ncpdt ?
Thanks
av
Hi,
By following the same Bond Set Param and HCI Commands, now I cannot able to pair a RF board with a PC Application.
When we are trying to connect with PC application with CC2540 USB dongle and Smart RF Board with CC2640, the connection has been done successfully. For Pairing procedure we are done the following steps.
In CC2640, RF board has been flashed from Simple BLE central project initialize as Peripheral.
Pairing Mode = GAPBOND_PAIRING_WAIT_FOR_REQ
GAPBOND_MITM_PROTECTION = Enabled
GAPBOND_BONDING_ENABLED = Disabled
GAPBOND_IO_CAPABILITIES = Display only
In PC App with CC2540 USB Dongle initialize as central role,
Pairing Mode = GAPBOND_PAIRING_DONT_WAIT_FOR_REQ
GAPBOND_MITM_PROTECTION = Enabled
GAPBOND_BONDING_ENABLED = Disabled
GAPBOND_IO_CAPABILITIES = Keyboard and Display
But, the Authentication has been end with failure as wrong passkey.
Since we have to exchange the passkey as displaying in RF board and enter the value in PC application to pair the devices.
Kindly help me on, to understand the issue and guide to make the Authentication success with proper Passkey exchange.
Regards,
Ramesh Kumar
Dear Experts
My customer want to use 8 microphone for voice/speech recognition application.
They would like to synchronize sampling between 8 array microphones on C64x DSP.
Do you have any example code?
Thanks for your comment.
製品版デバイス：Rev C がリリースされました。
Errataが対処されていますので、Primary版：Rev Bからの切り替えをお願いいたします。
１ 相違点まとめ
・ 相違点は下記の資料に纏められています。
Moving From Evaluation to Production With MSP432P401x MCUs slaa700
・ 大きなpointは下記です。
① Flash wait states ->3
③ LaunchPad EVM Rev:2 ->4
④ MSP-FET対応 ->5
２ ドキュメント
・ 現在（Aug.2.2016）下記がリリースされています。
① TRM(Technical Reference Manual) slau356d
② DS(Data-Sheet) slas826e
・ その他のツールとドキュメントは、②の下記に説明が有ります。
8.3 Tools and Software
8.4 Documentation Support
３ Flash wait states
・ 下記の相違が有ります。
製品版デバイス Rev:C（以降） Wait States: 0,1
Previewデバイス Rev:B Wait States: 0,1,2
・ Code Exampleなどにwait_2が残っていますが、少し遅くなる程度でトラブルにはなりません。
４ LaunchPad、MSP-EXP432P401R
・ ボードRev 2.0、 Device Rev:C となりました。 (Aug.1.2016)
新規購入時に、Revの確認をお願いします。
・ 旧Rev 1.0 on board emulator(XDS100)は、Device Rev Cへのemulatorとしては使用できません。
５ MSP-FET
・ MSP-FETに下記のアダプタを接続して、MSP432で利用できます。 CCSv6.3以降
MSP-FET-432ADPTR ・・ MSP-FETのJTAG 14pin をARM 20 pin/10 pin に変換するものです。
・ 取扱いの詳細は、MSP432 Hardware Tool User’s Guide slau571a でご確認ください。
・ MSP-TS432PZ100ボードと接続する場合は、別途ARM 20 pin-20pin ケーブルが必要です。
・ MSP-FETからARM 19 pin 経由で給電できます。
・ EnergyTraceを利用して、消費電力の計測ができます。
Hi
I am having a general question regarding RMII and RGMII interface as we have one requirement.
BR\Nitesh