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OPA551: Heat sinking the DDPAK/TO-263 package

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Part Number:OPA551

Hi,

Can someone clarify the correct connection method for the tab on the OPA551 DDPAK package. In section 5, (pin configuration and functions) it states that the tab should connect to the V- supply. In section 9 (power supplies), it states:

The tab of the DDPAK/TO-263 package is electrically connected to the negative supply (V–). However, this connection must not be used to carry current. For best thermal performance, solder the tab directly to the PCB copper area (see the Heat Sinking section).


Currently in our designs, the tab is floating. For a new application, I am looking at using vias to heatsink the tab to the V- (-15V) power plane but if I do this am I causing more problems?

I want to lower the thermal resistance to reduce the thermal resistance as in the new application we need a higher ambient temperature.

Any advice appreciated.


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