Solder Stencil Thickness for TMS5703137ZWT

Please confirm if there is a recomended solder mask stencil thickness for the TMS5703137ZWT.   In a TI document titled “Flip Chip Ball Grid Array Package Reference Guide” (Literature Number:  SPRU811A, May, 2005) the table on page 20 lists the stencil thickness at 150mm which is too thick.  The customer feels the stencil thickness should be around 0.15mm.

Please let me know if there is a document that specifies this requirement.

Thanks,

Tom