Part Number: TS3DDR3812
My customer needs to isolate RGMII signals when some circuit (CPU) is not powered up. They are using TS3DDR3812RUAR as an isolation barrier.
- Will TS3DDR3812RUAR carry the RGMII signals without introducing any issues?
- are there any other better IC built by TI for the job?
- Does TI provide some buffer IC or something similar that can help drive the RGMII signals between two chips that are separated by 8 to 10inch on PCB and traversing through a set of connectors?
- What is the maximum allowed distance (or not to exceed recommended distance) that RGMII signals can be routed in the PCB?
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Thanks!
Viktorija