Part Number:LM73606
(1) Are the NC pins on the LM73606 internally connected to GND? This question comes from thermal design consideration.
(2) What is the acceptable range of the 2.2uF on the VCC? Guessed it is defined by stability, I'd like to know how far the value is acceptable to be reduced. (for example, care for DC bias effect)
(3) When the Vout is unexpectedly shorted GND, is the device safely protected during power up sequence? (Expect working hiccup mode as Figure 64 on the datasheet.)
(4) Just a small question, what is a word of "DAP" for thermal pad stand for?
Thanks in advance.
S.Sawamoto