Part Number:TMS320F28379D
Hi,
I know that the TMS320F28379D chip has a built-in circuit called CLB.
However, I looked at the contents of the TRM document provided by TI, but I could not find anything about CLB.
Is there no official user manual document yet?
Is there any reference material for learning the circuit?
Are the CLB module only accessible through library functions provided in TI?
If so, I want to know what libraries are using the CLB functionality.
Thanks in advance.
Part Number:LDC2114
Hello Dear Forum,
I am trying to configure the registers of LDC2114, with my PIC18LF24K40 as Master as described in the datasheet. The communication protocol is I2C. I know the communication is working, since i can see the data in DATAx_MSB/DATAx_LSB registers changing as i approach the coils. I assume it is working with the default values in the registers for configuration.
I wrote the CONFIG_MODE Bit in RESET Register to 1, since i want to configure some registers according to my requirement.
But the STATUS register at 0x00 returns a value of 0x40 (CHIP_READY - Chip ready after internal reset) and not 0x60 (RDY_TO_WRITE and CHIP_READY) as expected.
I added a delay of 1ms after writing and before reading the STATUS register, but still it has the value of 0x40 and not 0x60 as expected. I cannot see what i am missing here.
Any feedback would be helpful.
Part Number:SN65LVPE502
Hello,
We applied USB compliance test which SN65LVPE502 is on the board and the result is failed as below items.
TD.1.1 No LFPS output
TD.1.2 No LFPS output, there is a waveform like CP0
TD.1.3 passed
TD.1.4 passed
TD.1.5 No loopback mode
Questions
1. Do we have a similar report which compliance test doesn't pass by using SN65LVPE502?
2. Do TI applied compliance test on SN65LVPE502? If it has done, how was the result?
I think there are some more questions after this but please let me ask this first.
Best regards,
Toshihiro Watanabe
hai.
we have been designing an inverter.Its a simple pushpull based one.We are using a push pull topology on the primary side of the design.The design has mosfets on the upper half and the lower half of the transformer.While the center tapped portion is connected to the a voltage range of 24 to 48.The transformer designed by us would output a +350v and -350v in the secondary on the corresponding cycles of the design.The major issue we are facing now is that the mosfets placed on the upper halfs and the lower halfs gets heated.What would be the possible reason for the heating of the mosfets on the half cycles of the design? Is it due to the spikes in the voltage in the drain, that results in heating of the mosfets? Will placing snubbers in the push pull design across the mosfets help? If so how will a design a snubber for a particular voltage range 24 to 48v Or is it due to the leakage inductance of transformer?
Part Number:TMDXIDK5718
Hi,
I would like to use AM5718 in one of my project.
The evaluation Board available in TI website is TMDXIDK5718. It is an industrial development kit. It is going to be my reference design.
My project needs a Audio codec, eMMC of different Make, NAND Flash etc.
TMDXIDK5718 doesnot have
1. Audio Codec
I have to port linux in my project. Since the EVM doesnot have Audio Codec, TI may not have driver codes/support for Audio codec (both configuration and data interface).
Can I use linux package of any other similar family(AM57x) to work on audio codec. Is there any EVM of AM5718 which provide Audio codec support??
Pls suggest.
2.
If I plan to use the below eMMC in actual project. How hard it will be to work (boot up) on different eMMC given TMDXIDK5718 uses another.
Will it create a development head ache??
4GB eMMC:- IS22ES04G-JQLA1
Datasheet-- 
Part Number:TPS254900-Q1
Dear Sir,
We tested TPS254900-Q1 EVM, it was found that even when CTL1 and CTL2 are kept low (operated in client mode), there’s 2.x V on OUT pin.
The following setups.
Could you help us learn what might be wrong?
Thanks, Ian.
Part Number:CD4053B
Hello E2E,
Our customer has plan to use the CD4053B on 3.3V single power.
This device's minimum power supply voltage is written 3V(Vdd-Vss) in datasheet.
However, data with 3V power is not on electrical characteristics table.
Could you provide the data for 3V power ?
Or, please let me know your opinion.
* I suggested the SN74LV4053A to customer.
Regards,
ACGUY
I am using RF4CE SDK 1.4.0.
For zigbee, the rf channel can be fixed.
How can I fix RF channels in RF4CE?
Part Number:TMS320F28335
Tool/software: Code Composer Studio
I found terms like AdcRegs.ADCRESULT0 >>4 in many programmes. I didn't get what is the meaning of >>4.
Also please help me on how to manipulate the ADC result data and store?
For Example, I need to subtract the AdcMirror.ADCRESULT0 from FFFF. Hoe to write the code and how to verify the results?
Tool/software: Linux
Hi all,
My test environment : Linux kernel version 4.4.84, J6 is used as PCIE EP conncting PC. I refer to this document “Linux Core PCIe EP User's Guide” as follows.
What is the cause of failure? Thanks for your help.
Part Number:TM4C1294NCPDT
Dear Champs,
Refer to below post, we hope to design USB Composite Device function for TM4C1299. Now usING DK-TM4C129X board test it.
https://e2e.ti.com/support/microcontrollers/tiva_arm/f/908/t/702763
For our design we need CDC, CDC, HID, Bulk, device. But we still have more related problems:
1. How can I expand to 4 device? To use usb_dev_cserial example code for modification
5. Put in TI box, usb_dev_cserial_3Port.zip is add CDC*3, Now I will change to CDC, CDC, HID, bulk.
txn.app.box.com/.../aqft2jg6oydnovi8lprxmasik2j6dzc9
But we still can't create more than 3 device like above modified code, could you kindly give us any suggestion?
Thanks a lot.
Part Number:CC2640R2F
Tool/software: TI-RTOS
Hello sir, Part number : CC2640R2F, This is my first project for TI. my application is body temperature monitor the wireless place through Bluetooth communication. my doubt is, how to develop ADC and Bluetooth interfacing code. I have knowledge about atmel, microchip and arm processor.
Part Number:AFE7070EVM
Hi,
Part Number:TPS709-Q1
Hi Support team,
My customer used TPS709-Q1 in their design and they need to confirm the power dissipation of TPS70950QDBVRQ1. They are asking what is the working condition for Figure 45 in the datasheet? i.e. Rth-ja, Rth-jc, derating factor etc.
Could you please provide the power dissipation table like in TPS73401-Q1 datasheet:
Thank you very much.
Best Regards,
Wei-Hao Chen
Part Number:ULN2003A
It is a failure issue in ULN2003A, ULN2003 has been used in similar design on many projects, but the failure happens in 3 prototype boards with total 10 prototype boards.
in the past usage, the c pins are all pulled up with 15V, the pull up resistor is >1Kohm, but in this design, both 5C and 6C are pulled up with 5V while 1C~4C are
pulled up with 15V. the COM pin is directly connected with 15V without any resistor.
the 3 ULN2003A chips are damaged in different 3 prototype boards, but after replace the damaged chip with new chip, the failure doesn't happen again.
the date code for these chips is 76C2XSK, local CQE has checked that there is no similar failure in the products with same date code.
Local team suggests to add 1Kohm resistor between COM pin and 15V.
for the root cause, could you give your comments or analysis?
thanks.
Below table is the pin impedance comparing between good chip and damaged chip.
| Pin # | Good Chip/ohm | failed chip 1/ohm | failed chip 2/ohm | failed chip 3/ohm |
| 1 | 12K | 28K | 12K | 4K |
| 2 | 12K | 28K | 12K | 4K |
| 3 | 12K | 28K | 12K | 4K |
| 4 | 12K | 25K | 9K | 4K |
| 5 | 12K | 28K | 12K | 4K |
| 6 | 12K | 28K | 10K | 4K |
| 7 | 12K | 16K | 12M | 9K |
| 8 | ||||
| 9 | 4K | Infinite | ||
| 10 | 10M | 16K | 30 | 12 |
| 11 | 10M | 16K | 20 | Infinite |
| 12 | 10M | 16K | 3M | Infinite |
| 13 | 10M | 16K | 20 | Infinite |
| 14 | 10M | 3M | 3M | 3M |
| 15 | 10M | 3M | 3M | 3M |
| 16 | 10M | 3M | 3M | 3M |
