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TMS320F28335: XCLKIN rise time

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Part Number:TMS320F28335

I’m currently working with a third party design which has TMS320F28335. I was investigating 30MHz clock signals and found out that rising and falling edges are not as steep as I expected.

Measured 10% to 90% rise time is 7.2ns so the actual rise time is about 6.2ns. That is, the clock signal is out of DSP specification. Now, I have few questions:

Q1:   I didn’t find clear specification how you specify rise time but I assume you mean 10% to 90% rise time. I.e. for 3.0V signal the time is sitting between voltage levels of 0.30V and 2.7V. Is that correct?
Q2:   Is 6.2ns rise time already a problem for DSP performance or do you have some safety margins? How big margins do you have? I mean, what would be an ultimate rise time I should never exceed?

(Green arrow shows the clock signal I'm concerned the most)


TMS320C6678: Dsp test failed

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Part Number:TMS320C6678

Hello team,

The attachment is customer's error document. The customer has checked the power supply and the result is normal. (Please visit the site to view this file)

AM3352: DDR3 routing rules

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Part Number:AM3352

Hi there,

I know the data sheet has mentioned the DDR3L layout guidelines, but there are somethings are not clear to me.

Would like to know below information.

1.) Should CLK be controlled as 100 ohm diff pairs?

CK/CKn , UDQS/UDQSn , LDQS/LDQSn

What is max length on CLK?

How about length matching for same pair? 

How about length matching for pairs to pairs?

2.) Should address line be controlled as 50 singled ended?

What is max length on address line?

How about length matching for each address line?

How about length matching for address vs clock ? do we need it ?

3.) Should data line be controlled as as 50 singled ended?

What is max length on data line?

How about length matching for each data line?

How about length matching for data vs clock ? do we need it ?

Thanks

CC2640R2F: MSP432 + CC2540R2F Dual MCU Advertise in Connection

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Part Number:CC2640R2F

Hello,

I am using MSP432 + CC2640R2F in dual MCU solution with CC2640R2F as Bluetooth Simple Network Processor.

For my application, I need to broadcast GAP advertise packet when the device is in connection with other GAP master.
I am still unsuccessful to broadcast the advertise packet when device is in connection.

Here is the outline on how I did it:

  • Set array as buffer for advertise packet when not in connection
  • Set array as buffer for advertise packet when in connection
  • Star advertise

So here is a snippet of the code:

static void NwkStateUpdateAdvertise (void)
{
    ...

    /* prepare advertise packet for not in connection */
    ...
    SAP_setParam(SAP_PARAM_ADV, SAP_ADV_DATA_NOTCONN,
                 (uint16_t)adv_data_len, Nwk_AdvertConnData);

    /* prepare advertise packet for in connection */
    ...
    SAP_setParam(SAP_PARAM_ADV, SAP_ADV_DATA_CONN,
                 (uint16_t)adv_data_len, Nwk_AdvertNonConnData);
    
    ...
}

static void NwkStateConnected (void)
{
    ...

    /* enable advertising and wait for response from NP */
    SAP_setParam(SAP_PARAM_ADV, SAP_ADV_STATE, sizeof(enable_adv), &enable_adv);
    Event_pend(Nwk_Event, NWK_EVT_NONE, NWK_EVT_ADV_ENB, 500);

    ...
}

These two functions are state machine. NwkStateUpdateAdvertise will call the SAP library to prepare advertise packet for not in connection and for in connection. I use different array buffer since the contents of the advertise packet are different.
Then on NwkStateConnected which is a state when the device is in connection, I call the SAP library to start advertising.

I read from Simple Network Processor API Guide at section 9.3.2 SNP Set Advertisement Data (0x43):
" When not in a connection, if advertisement is requested, the advertisement data stored in the non-
connected state buffer will be advertised.
When in a connection, if advertisement is requested, the advertisement data stored in the connected
state buffer will be advertised. "

  1. I believe I am not doing it correctly, is there any advice or suggestion to correct this?

Thank you

RTOS/PROCESSOR-SDK-AM437X: FAT volume size issue

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Part Number:PROCESSOR-SDK-AM437X

Tool/software:TI-RTOS

Hi,

I'm trying to make f_mkfs() work on TI-RTOS.
I define : 

#define	_USE_MKFS		1

in ffconf.h.

In example I add:

FATFS_DrvFxnTable FATFS_drvFxnTable = {
    MMCSD_close,
	CS_eMMC_control,//MMCSD_control
    MMCSD_init,
    MMCSD_open,
    MMCSD_write,
    MMCSD_read
};

In IOctr function, sector and block data reports was impelmented:

MMCSD_Error CS_eMMC_control(MMCSD_Handle handle, uint32_t cmd, void *arg){
//	MMCSD_OK
	MMCSD_v1_Object            *object = NULL;
	DWORD *tmp;
	tmp = arg;
    /* Input parameter validation */
    OSAL_Assert(handle == NULL);

    object = (MMCSD_v1_Object *)((MMCSD_Config *) handle)->object;

    switch(cmd){
    case CTRL_SYNC:
    	//check
    	return FATFS_OK;
    	break;
    case GET_SECTOR_COUNT:
    		*tmp = (DWORD)object->size / (DWORD)object->blockSize;
    	return FATFS_OK;
    	break;
    case GET_SECTOR_SIZE:
    	*tmp = (DWORD)object->blockSize;
    	return FATFS_OK;
    	break;
    case GET_BLOCK_SIZE:
    	*tmp = (DWORD)object->blockSize;
    	return FATFS_OK;
    	break;
    case CTRL_TRIM:
    	return FATFS_OK;
    	break;
    case CTRL_EJECT:
    	return MMCSD_close(handle);
    	break;
    default:
    	break;
    }
    return (((MMCSD_Config *) handle)->fxnTablePtr->controlFxn(handle, cmd, arg));
}

f_mkfs() make partition of approx. size  1.7MB or it fail to make filesiystem....

Any knowing issues?

Best Regards,

Mare

BQ27510-G3: failed to report `charge_full_design' property

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Part Number:BQ27510-G3

Hi,

We are using BQ27510-G3 fuel gauge for  our custom board. When i try to read the capacity I am getting the below error.

power_supply bq27510-0: driver failed to report `charge_full_design' property: -5

Please give me the solution to solve the same.

Regards,

Sharmila

RTOS/PROCESSOR-SDK-AM335X: Compiled code download

CC2564: how to know if the CC2564 is advertising or not for further pairing?

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Part Number:CC2564

Hello, simple question I guess... We need to detect when the CC2564 is no more advertising the device name for pairing (or can we keep it alive even after a successful LE connection?). We are using the SPP LE stack, and we need to re-advertise by sending AdvertiseLE 1 command after the current connections are terminated...is there any status bit set somewhere?

Thanks

Florent


DS100MB203: Intra-Pair(P/N) Skew inside DS100MB203 package

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Part Number:DS100MB203

Hi Sir :

   Do you know Intra-Pair(P/N) Skew inside DS100MB203 package ?

   Or where we can find the document about this topic?

    thanks

Lotus

TPS2376: POE is not recognized by smart Gigabit switches.

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Part Number:TPS2376

POE is not recognized by smart Gigabit switches. The switch does not start to deliver POE power. We designed with TPS2376DDA-H on class 0. Formerly we used LM5073 also on class 0 and that is recognized by all switches.

Does anyone have an idea what could cause this problem.

We used the recommended design for this part.

RTOS/TM4C1294NCPDT: Tiva C Oscillator startup time

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Part Number:TM4C1294NCPDT

Tool/software:TI-RTOS

Hi,

Does TIRTOS for TIva C sample codes consider startup time of crystal oscillator?

Currently we are using Ethernet sample code from tirtos_tivac_2_16_01_14,
but cannot find where exactly the crystal settings are done and  does it include proper delay for startup time of crystal?

All the sample codes has below INIT functions but there is no clock settings.

Board_initGeneral();
Board_initGPIO();
Board_initEMAC();

Best Regards
paddu

RTOS/TDA2P-ACD: ORB performance on EVE : Estimated DDR BW

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Part Number:TDA2P-ACD

Tool/software:TI-RTOS

Hi Anshu, Pramod,

Can you please provide us with expected DDR load for ORB with following parameters.

Data Format RGBA 8888, 4 video frame, @ 60 FPS.

Scales are 256x540 & 197x415

Following are some assumptions

1. that data is in DDR and internal memory

2. Scales generated by independent scaler

3. Scales generation is done in EVE

Regards,Sujtih

ADS131A02: Can I leave the Data Ready (DRDY) unconnected in Synchronous Slave Mode

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Part Number:ADS131A02

I have only four SPI signals between CPU and ADS131A02 , and I want to use the ADC in  Synchronous Slave Mode.  should I  tied  DRDY directly to CS , just like the connections of  figure 62 in datasheet.  in this mode, Dose ADC work OK  if I  leave DRDY unconnected.

Linux/PROCESSOR-SDK-AM335X: How does pru print debugging information?

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Part Number:PROCESSOR-SDK-AM335X

Tool/software: Linux

I want to test some mathematical operations of pru. I need to print out the results. What should I do?

Is my debug information written to memory in the pru and then read out of memory?If so, how do I write data in pru to memory and read it in arm?

TDA3MV: Dual memory controller PCB tracing (with ECC)

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Part Number:TDA3MV

Hello,
we making designs of some ADAS devices on TDA2, TDA3. Sure we have NDA.
We want use dual memory controller configuration. But all that we seen before (EVM and other designs) using only one memory controller.
Where can we get PCB tracing (design or recommendations) for dual controller + ECC?
Recommendation about tracing of FCBGA 784 (ABZ package) will be useful too.


TMS320F28377S: F28377S Bootcode cannot jump to APP

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Part Number:TMS320F28377S

Hi Champion.

My customer use F28377S deisng a SCI bootloader themselves and they find boot code cannot jump to app, but if connect Uniflash to verify all code, it can work and when reset, boot code also cannot jump to app. They have try to download app and boot code driect as uniflash, it can run well. So can you give me some suggestion ahout the root cause ?

Thanks!

BR

Joe

BQ4050: device does not enter SLEEP mode

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Part Number:BQ4050

Hello,

I am not able to put my device into sleep mode. To detect a SLEEP mode, I watch the current consumption with an amperemeter, since I obviously cannot read the status bits (SMBC/SMBD signals wake up the device).

I measure 350 µA in the battery branch, which corresponds to the NORMAL mode.

After meeting all conditions, I cannot see a current reduction in my battery branch. I would expect it going down to some 80 µA.

SLEEP mode conditions:

- "Settings/Configuration/DA Config[SLEEP]"= 1

- "Settings/Configuration/DA Config[NR]"= 1

- "Power/Sleep/Wake Comparator" = 625 µV / 10 mR = 62.5 mA

- "Power/Sleep/Voltage Time" = 5

- "Power/Sleep/Current Time" = 20

- "Power/Sleep/Bus Timeout" = 10

- OperationStatus()[SDM] = 0

- Current() = 0 ("Power/Sleep/Sleep Current" = 10 mA)

- no Safety or PF bit is set

- when deconnecting the SMBus, there is no voltage left at SMBC & SMBD, the pins are left floating.

Any help is appreciated.

Thanks in advance.

Frank

(Please visit the site to view this file)

AWR1642BOOST: Stepped-frequency CW instead of FMCW

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Part Number:AWR1642BOOST

Can i use SFCW instead of FMCW with this EVM. If yes can you please brief how do i upload my own wave configuration on the EVM.

Regards 

Rahul Kumar 

DRV8432: Is switching G_VDD a good idea ?

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Part Number:DRV8432

Hello,

I am using a DRV8432 to drive a 24V DC motor.

For safety reasons, the 24V is externally switched so that I can guarantee there is no power delivered when it is not required.

I use the same switch control for the G_VDD rail (12V).

We ran some endurance tests and the 12V rail eventually when shorted to ground. When disconnecting the G_VDD pins from the 12V rail, the 12V came back to normal so the conclusion is that the DRV8432 is burnt.

Is this a bad idea to switch the G_VDD off ?

Would it be better not to switch the G_VDD (keep it to 12V all the time even when the P_VDD if off) ?

Thanks,

Nicolas

ISO1050: how to improve the system level ESD performance for ISO1050

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Part Number:ISO1050

Hi,

 We failed at ESD test level 3 6KV contact discharge, air discharger 8KV.  contact discharge 4KV is okay.

Here is the schematic. Can you give some suggestion how to improve the system level ESD performance?

 

Thanks.

 

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