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LM4050QML-SP: Conductive / Grounded Lid

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Part Number: LM4050QML-SP

Hi. Is the lid on this part conductive, or ceramic? and if it is conductive, is it tied internally, or floating?

Thanks,

Eric


PGA308EVM: Unable to connect to board via USB

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Part Number: PGA308EVM

The PGA308EVM board is unable to connect with any of the computers at our office. We have tried multiple boards, multiple computers, changed all the wires and power supplies, and even went as far as to order a new board to ensure that the others that we had hadn't degraded. The only screen that we get is the typical USB Communications problem popup that you get if you try to run the PGA308 cal software without the EVM board plugged in.

LAUNCHXL-CC2640R2: LAUNCHXL-CC2640R2

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Part Number: LAUNCHXL-CC2640R2

I am working on developing software for CC2640R2F RSM microcontroller. This microcontroller form factor only has 10 pins, and I was wondering if the analog pins are configured with ADCs. Analog pins are DIO5-DIO9. 

TPS65987EVM: DP alt mode with Samsung Galaxy S8

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Part Number: TPS65987EVM

Hi

I have a TPS65987EVM that I'm trying to use as a DP sink. I have the 10G-EXPANSION sink board attached.

I have DP outputting from a Macbook Pro fine but cannot get DP coming from the Samsung Galaxy S8. I've looked through the forum and have seen that a number of users have had issues with Samsung devices but without much resolve.

The S8 will output DP fine using a Kingston USB-C to HDMI adapter.

I have a Cypress CY4500 analyser that I have used to probe both connection events that I've uploaded. I've tried changing as many settings in the customisation tool that I can see to try and replicate the messages from the adapter. I read the thread below and also tried the initiate ufp swap.

https://e2e.ti.com/support/interface/f/138/p/825152/3065998?tisearch=e2e-sitesearch&keymatch=tps65987%2520samsung%2520galaxy#3065998

Any ideas would be greatly appreciated.

Thanks

(Please visit the site to view this file)(Please visit the site to view this file)

BQ25713: BQ25713 waveform issue

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Part Number: BQ25713

Hello

     Customer find out VBUS can not charge due to VSYS trigger Vth1 and retry 7 times still not achieve target voltage. So the charger is VAP failed. Per waveform, customer decrease OTG current to 0.3A and let VBUS charge to 20V. Then customer set OTG current 0.5A, but VBUS voltage will not start up after load current. 

1. why can support OTG current to 0.5A to happen VBUS not start up issue?

2. Below waveform, why VSYS has lager Vdop(300mV)?

3. What is OTG setting current ? Is VBUS charging current? 

4. After trigger Vth1 10us, VBUS just charge. Does it correct and have de-glitch time spec. ? (Datasheet specified 5us)

5. After  trigger Vth2, prochot# active after 6us, Does it correct and have de-glitch time spec. ? 

6. For 2S battery design, what is safe VAP setting that have not start up issue ? 

7. How to modify charger compensation to get better ripple/transient? 

8. Has Ripple/transient spec or waveform for 2S batter application for customer reference? 

BR

Patrick

 

     

 

 

ADS8910B: Full Scale Range

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Part Number: ADS8910B

Hi;

On the ADS8910B datasheet page-22, you have:

FSR=+/-Vref

I will interpret it as:

FSR = Vref -(-Vref) = 2*Vref

So this matches the 1LSB formula on page-23

1LSB = (2*Vref)/(2^18) = Vref/2^17

Now, if I connect 2.5V reference voltage to REFIN(pin-3) and connect REFM pin to ground, then I will get 1LSB voltage as following. 

If Vref = 2.5V, then 1LSB = 19.07uV

Is my understanding correct? Please confirm. Thanks so much!

Wen

TMDXIDDK379D: TMDXIDDK379D

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Part Number: TMDXIDDK379D

Hello sir,

I am using DesignDRIVE IDDK kit to develop motor control system, all system work properly the problem is only Accelration and Deceleration, How can I set required Acceleration and  Deceleration, I can set maximum Accel. By setting the speed PI loop saturation value but I want to know how can I set desired Acceleration and Deceleration according to system application like Variable frequancy derive.

Regard

TMP431: TMP431 Datasheet Update

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Part Number: TMP431

When is the datasheet being updated for the TMP431 per previous discussion "TMP431 - SMBus Alarm and ALERT Pin issues"? from May 2019


CCS/TINA-TI: Code Composer Studio™ forum

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Part Number: TINA-TI

Tool/software: Code Composer Studio

Need to find 3db bandwidth for the circuit attached below. Error is showing up as only one input is allowed.

CCS/CC3120BOOST: Issue with communication between firebase real time database and CC3120 Boost simplelink and missing root CA

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Part Number: CC3120BOOST

Tool/software: Code Composer Studio

Hello

I'm having issue when communicating firebase real time database from CC3120 wifi module using RESTFUL API. I found that its root CA is missing from the CC3120 Simplelink root CA catalog. Firebase uses "GTS CA 101" as its root CA and it is missing in CC3120 root CA catalog. Could you please help to check whether it is still possible to communicate with firebase further? If so, could you please show a way to add the missing cert inside? Thank you.

The following link shows the simplelink root CA catalogue.

http://software-dl.ti.com/ecs/SIMPLELINK_CC3220_SDK/1_02_02_00/exports/tools/cc32xx_tools/certificate-catalog/readme.html?fbclid=IwAR1__21ICs5dfXOQ1HVTQwEm078ud0DCkElIlThLWzvdlhnSYlWVXmMrJCw

This link indicates firebase root CA. Firebase Root CA can be checked here https://www.digicert.com/help/   where https://minmin-68c89.firebaseio.com as the host to search.

Regards

Min Min

TI-PLC-G3-DC: Apply For G3 DC Special Version

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Part Number: TI-PLC-G3-DC

Hi,

I repost this thread as another thread end up with no reply. Some one told me I would see something back from him Monday or Tuesday at the latest.  I keep waiting but so far I didn't get anything.

Who can tell me if there are something wrong in my step?

DAC900: Source current for 200mA

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Part Number: DAC900

Dear TI Exterts

I am looking for a DAC, (Source current architecture)which can support 200mA current

Can DAC900 + Amplifier support this?

Do you have any reference about this?

LAUNCHXL2-570LC43: Network and communication benchmarking with LAUNCHXL2-570LC43 kit?

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Part Number: LAUNCHXL2-570LC43

Hi,

I´m working to implement and test a isolated industrial network and I´m testing the LAUNCHXL2-570LC43 development kit. So I´d like ask the following questions:

1) Are there a communication benchmarking or tutorial to implement a network with LAUNCHXL2-570LC43?

2)  Most examples that I found in TI site was done with different versions of Hercule´s kits and CCS (I saw version 4, 5 and 6). I´m trying the CCS 8 and Hallogen. Is it the best choice?

Have anyone here implemented an network application with LAUNCHXL2-570LC43? Is it working? Could you give me some hints about communication protocols  (TCP/IP or other?), operational syspem (linux or other?) and services (sockets or other?) to use? 

Thanks,

Geraldo.

Problem reading ID ADS1298 over SPI with Raspberry pi 2 B

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Hello,

I am a newbie and recently doing my project with ADS1298 and trying as first step to power the ADS1298EVM (without MMB0) by Raspberry Pi 2 Board (I am not sure if it is possible?). Im trying to build SPI between them (ADS as Slave, Raspberry Pi as Master). But i didnt get the result that i expected when i read the ID device. My SPI connections look like this:

Raspberry                                            ADS1298EVM

    3.3V                      -----                      Pin 9 (on J4)

    GND                     -----                      Pin 6 (on J4)

   Pin 23 (SCLK)       ------                     Pin 3 (CLK) (on J3) 

   Pin 24 (CE0)         -------                    Pin 7 (CS) (on J3)

   Pin 19 (MOSI)      -------                     Pin 11 (DIN) (on J3)

   Pin 21 (MISO)       -------                     Pin 13 (DOUT) (on J3)

   Pin 12 (GPIO 18)    -------                   Pin 8 (RESETB) (on J3)   

    and here is my code ussing BCM2835 Library :

#include <fcntl.h>
#include <sys/ioctl.h>
#include <linux/spi/spidev.h>

#include <stdio.h>
#include <bcm2835.h>
#include "/home/pi/Desktop/ADS1298.h"

#define CS_PIN RPI_BPLUS_GPIO_J8_24 //CS pin CE0
#define RESET_PIN RPI_BPLUS_GPIO_J8_12 //GIPO pin 18
#define MOSI_SPI RPI_BPLUS_GPIO_J8_19 //MOSI | GPIO 10
#define MISO_SPI RPI_BPLUS_GPIO_J8_21 //MISO | GPIO 9
#define CS_DELAY 5

void cs_select()
{
bcm2835_gpio_clr(CS_PIN);
}

void cs_deselect()
{
bcm2835_gpio_set(CS_PIN);
}


int main(int argc, char **argv)
{
char buffer[3];

if(!bcm2835_init())
{
return 1;
}


bcm2835_spi_begin();

bcm2835_gpio_fsel(RESET_PIN, BCM2835_GPIO_FSEL_OUTP); //set RESET_PIN as an output
bcm2835_spi_setBitOrder(BCM2835_SPI_BIT_ORDER_MSBFIRST); //set bit Order
bcm2835_spi_chipSelect(BCM2835_SPI_CS_NONE); //do not set CS automatically

//bcm2835_gpio_fsel(MOSI_SPI, BCM2835_GPIO_FSEL_OUTP); //set MOSI_SPI as an output
//bcm2835_gpio_fsel(MISO_SPI, BCM2835_GPIO_FSEL_INPT); //set MISO_SPI as an input
bcm2835_gpio_fsel(CS_PIN, BCM2835_GPIO_FSEL_OUTP); // set CS_PIN as an output

bcm2835_spi_setClockDivider(BCM2835_SPI_CLOCK_DIVIDER_16); //1.2 MHz
bcm2835_spi_setDataMode(BCM2835_SPI_MODE1);

//reset the device
bcm2835_gpio_write(RESET_PIN, LOW);
delay(2);
bcm2835_gpio_write(RESET_PIN, HIGH);
delay(128); //0.128s required

buffer[0]=(RREG | ID);
buffer[1]=0x00;
buffer[2]=0x00;

printf("Before spi_transfern:\n");
printf("Hexa value of buffer[0] = %x \n", buffer[0]);
printf("Hexa value of buffer[1] = %x \n", buffer[1]);
printf("Hexa value of buffer[2] = %x \n\n", buffer[2]);

cs_select();
bcm2835_spi_transfer(SDATAC);
bcm2835_delayMicroseconds(CS_DELAY);
cs_deselect();
bcm2835_delayMicroseconds(5);

cs_select();
bcm2835_spi_transfern(buffer,3);
bcm2835_delayMicroseconds(CS_DELAY);
cs_deselect();

printf("After spi_transfern:\n");
printf("Hexa value of buffer[0] = %x \n", buffer[0]);
printf("Hexa value of buffer[1] = %x \n", buffer[1]);
printf("Hexa value of buffer[2] = %x \n", buffer[2]);

bcm2835_spi_end();
return 0;
}

Wiring 2 device:

But i only get this rerult :

And then this when i took the 2 power connections out from Raspi to J4 on ADS1298: 

          

It seems like the value changed sometimes somehow when i connect and reconnect the 2 power wires to J4. As prove i have got this result after i put the power wires on J4 again:

              

SN74LVC2G32-EP: Rated Junction Temperature

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Part Number: SN74LVC2G32-EP

Hi,

Greetings.

Our customer is looking for the rated junction temperature of SN74LVC2G32-EP however it is not available on the datasheet. We would appreciate if you could provide us this information.

Looking forward to your response.

Thank you and have a great day!


Regards,

Cedrick


TMS570LC4357: DMA fallback register

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Part Number: TMS570LC4357

Hi there,

While debugging a DMA issue, I ran into this FBREG field in the HALCoGen DMA register structure. Based on the spec this offset is reserved or internal but when I see the reference code, it is defined as Fallback register. What is the meaning of this register and do we have updated specs or erratas for all such additions?

Thanks,

Salyl

TMS570LC4357: Network and communication benchmarking with LAUNCHXL2-570LC43 kit?

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Part Number: TMS570LC4357

Hi Guys,

I´m working to implement and test a isolated industrial network and I´m testing the LAUNCHXL2-570LC43 development kit. So I´d like ask the following questions:

1) Are there a communication benchmarking or tutorial to implement a network with LAUNCHXL2-570LC43?

2)  Most examples that I found in TI site was done with different versions of Hercule´s kits and CCS (I saw version 4, 5 and 6). I´m trying the CCS 8 and Hallogen. Is it the best choice?

Have anyone here implemented an network application with LAUNCHXL2-570LC43? Is it working? Could you give me some hints about communication protocols  (TCP/IP or other?), operational syspem (linux or other?) and services (sockets or other?) to use? 

Thanks,

Geraldo.

CSD17575Q3: SON3X3 package footprints

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Part Number: CSD17575Q3

Comparing two part datasheets (CSD17575Q3 and CSD17304Q3) with identical packages (SON 3.3mmx3.3mm), looking at recommended footprints:

1) Recommended Footprint Drawing note M0143-01 for CSD17304Q3 shows a standard QFN footprint -- along with what looks like a stencil / solderpaste drawing showing with two side "wings" coming from the main pad in the center of the package (is this to deposit paste over the soldermask of the first drawing?)

2) CSD17575Q3  shows a more standard QFN package with a "recommended stencil drawing" that does not show these side "wings"

What is the recommended footprint for this "Q3" package?  Is there a reason that these two tabs are not included in all "recommended footprint" drawings for this package?

Thanks - James

CC3100: SL_recv returns 0

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Part Number: CC3100

Hello,

on sl rcv in multi Tasked blocking Mode, it returns 0 with no Data Sent. What does this mean? Error code is "everything ok". But this cant be since, i didnt receive Data.

TLV62569: TLV62569DBV P2P solution with Forced PWM mode

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Part Number: TLV62569

Hi Team,

Do we have TLV62569DBV/SOT-23 P2P solution to meet the specs below? Thanks!

1. Input voltage= 3.3V

2. Max output current= 2A

3. Forced PWM mode

4. Switch frequency >= 1MHz

5.  Soft Start Time, Tss >=1.2mS  at the conditions of VIN = 5V & VOUT= 2.5V

Best regards,

Sam Ting

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