Part Number:IWR6843ISK
Tool/software: TI-RTOS
Hi,
I find BIOS_start() always called in the end of main() function, and what's the use of BIOS_start()?
Thanks!
Part Number:IWR6843ISK
Tool/software: TI-RTOS
Hi,
I find BIOS_start() always called in the end of main() function, and what's the use of BIOS_start()?
Thanks!
Part Number:TPS65218
Hi,
I'm recognizing that the TPS65218B1 has problem as below file.
My customer has already been using the TPS65218B1 and afraid that the problem occurs.
If these problems have never happen, will not they occur?
Could you share the cause of these problem?
Best Regards,
Kuramochi
Part Number:BQ76940
Dear experts,
Our customer noticed that there is a problem in our low side CHG and DSG driver project . The attached file is our schematic, we followed the connection in bq76940 datasheet. And we also noticed some reference design adds a 1k resistor R4 between CHG pin and CHG mos gate (as below), I wonder what the effect of this 1k ohm resistor is and can this resistor be ignored (now the customer sets R4 0 ohm).
Our problem is when CHG and DSG mos off, the pack still has voltage on it when we measure it with multimeter. And some end customers thought it's dangerous. After testing, customer found there is leakage current on the line between CHG pin and CHG mos gate, about 20-30uA. When customer disconnected this line by taking off 0 ohm R4, the voltage disappeared.
Could you help us to solve the problem and tell me the effect of R4 resistor? Thanks a lot.
Part Number:DLP4500
Hello All,
I managed to get external trigger from my microscope to Lightcrafter4500 EVM
But I am having trouble with some LED background light.
Let me explain here. I am using Lightcafter4500 EVM (J10, Pin1 ref, Pin2 +ve, Pin 3 ground)
Qs-
1- What is causing the background LED current between the trigger signal?
2- Why I need to press Play --Pause-Play (play twice) to get trigger signal working?
FYI- I follow my input trigger from the microscope and DMD light output (via photo-diode) on an Oscilloscope. So, I can see the input trigger and DMD light output.
Thanks a lot in advance!
Part Number:SN74AVC16T245
Dear, Sir.
My customer is applying SN74AVC245 for their system and PCB has been completed.
They had a mistake on the circuit because 1DIR/2DIR was connected to 3.3V system.
But tthe device looks working correctly.
The usage is same as the below.
I wonder the device is not broken due to this kind of miss-connection?
Please give your advice.
Best Regards,
H. Sakai
Part Number:TPA3130D2
hello
we adjust the value of R1 and R37 in our circuit, but we cannot find the Pout become higher or lower.
what should i do to limit the Pout?
Thanks
Part Number:TPS65988DJ
Hello E2E.
I have interesting for TPS65988DJ. Do you have plans to sell EVM?
Regards,
CGUY
Part Number:AM3352
Does the AM335x family of processors support TBCC encoding and Viterbi decoding? Is there a library that supports TBCC encoding and Viterbi decoding? If the AM335x does not support the above functions, is there any other processor to choose from?
Thank you~
Part Number:LM5056A
Dear Team,
The I2C read mode of the LM5056A is bit bank I2C is not a regular regular I2C. Dell said that their OS6 code does not support bit banks, so Dell asks us to find out if there is no pin to pin. If there is no pin to pin, please help recommend a suitable one.
I check on the TI.com website, it seems this one is the only solution to measure voltage up to 80V.
Because they use this device to measure 54V rail.
Or they need to use a different approach?
BR
Kevin
Part Number:TDA2EVM5777
Tool/software: Linux
How to display a RGB_24_888 video frame via display link?
Part Number:TLC5955
Dear Sir/Ms.
Our customer currently design the TLC5955RTQR as a stack of 5 strings.
The test found the following problems.
1. The temperature of the first one will be higher than the latter. Will this be the case with actual use?
2. The last TLC5955 is not full, but the last TLC555 channel is broken down (low impedance). Have you seen this situation? How to design the channel that is not used?
3. Throw into the ring temperature furnace. When the IC temperature is greater than 85 degrees C, abnormal operation will occur (for example: the current of each channel cannot be turned off, and the output is always 20mA). The restart is also the same. The entire board must be taken out and cooled down before it will return to normal again. Is this situation normal?
4. If the LED Vf=3V, what is the VLED voltage I need?
At present, the channel needs to be set to 20mA due to the demand. The actual VLED=6V~~ is designed. Is there any problem with the design? How to calculate the peripheral circuit?
This customer is very good. If you still want more information to judge, please let me know, I can ask the customer.
Best Regards,
Kami Huang
Part Number:TM4C1294NCPDT
Tool/software: Code Composer Studio
Dear all,
I am working with TIVA TM4C1294NCPDT controller in custom made PCB. My project architecture is,
In this project, I need to update the application code (boot loader) of PCB 2 and PCB 3 via PCB 1.
Options available are,
Kindly provide your support.
Regards,
Iyyappan.V
iyyappan_krish@yahoo.co.in
+91 8144921242
Part Number:MSP432P401R
Hello,
I have confusion regarding SimpleLink SDK Bluetooth Plugin with MSP432P401R + CC2640R2. It says that to achieve deeper low power mode such as LPM3, the SAP_close must be called in order to release the UART driver. I am currently using SimpleLink SDK Bluetooth Plugin 1.40.00.42.
I observe the code from reference design for Access Control Panel with BLE:
http://www.ti.com/tool/tidm-1004
What I found is the SAP_close only executes when AP_taskFxn is on AP_SBL state. During normal operation there is no call to SAP_close but device can be set to release constraint even for deeper sleep modes LPM4.
My application needs to cycle between period of idle (go into LPM3) and period of awake. Because I always call to SAP_close before entering period of idle, I need to reinitialized the SAP, SAP_reset and reinitialize services and characteristics each time the idle period has been up. It consume more power from my observation using EnergyTrace.
When I remove the SAP_close on my application and still call the power API to release constraint so it can go into LPM3, I found that my application still runs well. From debug session it still executes PCM_gotoLPM3. Without reinitialization frequently on CC2640R2 I also get better battery life with additional 4-5 days.
Does this behavior is expected? May need to clear things-up just to be sure of it.
Thank you & warm regards,
Part Number:F28M36P63C2
I am modifying my bootloader code so that it can read/write the flash memory. The logic was working fine on application code already. But when I port over to the boot loader. In the log_clear runction, Fapi_getFsmStatus returns 0x810. The SECTION definition looks fine to me. Here comes the flash access code segment.
/* Private Variables ------------------------------------------------------------------- */
#pragma DATA_SECTION(log_entries, "LOG_ENTRIES"):
Log_Entry log_entries[LOG_NUM_ENTRIES];
unsigned log_next_free;
#pragma CODE_SECTION(log_init, "ramfuncs");
void log_init(void)
{
// /* Enable writes to protected registers */
// HWREG(SYSCTL_MWRALLOW) = 0xA5A5A5A5;
/* Gain control of the flash pump */
FlashGainPump();
FlashInit();
/* Initialize FLASH API based on system frequency of 75 MHz before any other Flash API
* calls can be made. */
Fapi_StatusType fapiStatus = Fapi_initializeAPI(F021_CPU0_BASE_ADDRESS, 75);
if(fapiStatus != Fapi_Status_Success)
{
printf("Flash API Initialization Error: %d\n", fapiStatus);
}
/* Set the Flash bank and FMC for further Flash operations to be performed on the
* bank */
fapiStatus = Fapi_setActiveFlashBank(Fapi_FlashBank0);
if(fapiStatus != Fapi_Status_Success)
{
printf("FAPI set active flash bank failed: %d\n", fapiStatus);
}
/* Yield control of the flash pump */
FlashLeavePump();
// /* Disable writes to protected registers */
// HWREG(SYSCTL_MWRALLOW) = 0;
/* Find the next free log entry */
Log_Entry* entry;
for(log_next_free = 0; (entry = log_entry(log_next_free)); log_next_free++)
{
if(log_empty(entry))
{
System_printf("log_init: No log entry\r\n");
break;
}
}
}
#pragma CODE_SECTION(log_clear, "ramfuncs");
int log_clear(void)
{
static uint32_t* FLASH_SECTOR_A = (uint32_t*)(0x002F8000);
Fapi_FlashStatusType fStatus;
Fapi_FlashStatusWordType oFlashStatusWord;
Fapi_FlashBankSectorsType oFlashBankSectors;
int nRet = 0xff;
/* Gain control of the flash pump */
EnterFlashProg();
fStatus = Fapi_getBankSectors(Fapi_FlashBank0,&oFlashBankSectors);
if(fStatus != Fapi_Status_Success)
{
nRet = 1;
return nRet;
}
while(Fapi_checkFsmForReady() != Fapi_Status_FsmReady) { }
Fapi_issueAsyncCommandWithAddress(Fapi_EraseSector, (uint32*)FLASH_SECTOR_A);
/* Wait until FSM is done with erase sector operation */
while(Fapi_checkFsmForReady() != Fapi_Status_FsmReady) { }
fStatus = Fapi_doBlankCheck((uint32*)FLASH_SECTOR_A, 0x2000, &oFlashStatusWord);
if(fStatus != Fapi_Status_Success)
{
//Check Flash API documentation for possible errors
//If Erase command fails, use Fapi_getFsmStatus() function to get
// the FMSTAT register contents
//to see if any of the EV bit, ESUSP bit, CSTAT bit or VOLTSTAT
//bit is set (Refer to API documentation for more details)
nRet = 2;
return nRet;
}
// Get the Flash state machine status which will indicate the results of the last write
fStatus = Fapi_getFsmStatus();
if (fStatus != Fapi_Status_Success)
{
nRet = fStatus; /* return 0x810
return nRet;
}
/* Yield control of the flash pump */
LeaveFlashProg();
log_next_free = 0;
nRet = 4;
return nRet;
}
unsigned log_count(void)
{
return log_next_free;
}
Following is the cmd file:
#define FLASH_BOOTLOADER_VEC FLASH_BOOT
// FLASH (the rest of the code) goes into FLASH_BOOTLOADER
#define FLASH_BOOTLOADER FLASH
#include "F28M36_M3_MEMORY.lds"
SECTIONS
{
/* Allocate program areas: */
.text : > FLASH
.cinit : > FLASH
.pinit : > FLASH
.binit : > FLASH
.init_array : > FLASH
/* Initialized sections go in Flash_B */
.const : > FLASH
/* Allocate uninitalized data sections: */
.bss : > C03SRAM | RAM2 // place the largest block first
.data : > C03SRAM | RAM2
.sysmem : > C03SRAM | RAM2
.stack : > C03SRAM | RAM2
.cio : > C03SRAM | RAM2
.neardata : > C03SRAM | RAM2
.rodata : > C03SRAM | RAM2
.args : > C03SRAM | RAM2
.exch_mem : START(TFSystemGlobalData_address) > EXCHANGE_RAM
.smem_m3_tx : START(SmemTransportM3TxStart) > SMEM_TRANSPORT_M3_TX
.smem_c28_tx: START(SmemTransportC28TxStart) > SMEM_TRANSPORT_C28_TX
.app_storage: START(AppFlashStartAddress) > FLASH_APPLICATION_VEC
.flash_log : START(FlashLogAddress) > FLASH_LOG
.end_flash : START(AppFlashEndAddress) > FLASH_LOG
LOG_ENTRIES : > FLASH_LOG, ALIGN(4)
GROUP
{
ramfuncs
{
-l F021_API_CortexM3_LE.lib
}
} LOAD = FLASH,
RUN = C03SRAM,
LOAD_START(RamfuncsLoadStart),
LOAD_SIZE(RamfuncsLoadSize),
LOAD_END(RamfuncsLoadEnd),
RUN_START(RamfuncsRunStart),
RUN_SIZE(RamfuncsRunSize),
RUN_END(RamfuncsRunEnd),
PAGE = 0
}
Part Number:BQ25890H
Hi,
I'm wondering if this chip can be used like BQ25895 where the boost output is on PMID only, and boost mode will automatically switch off when VBUS is attached to a charger? It seems like BQ25895 does not allow host to control D+/D- level.
If not, are there any USB switch with charger detection like BQ25890H but with charging functionality stripped?
Thanks.
Part Number:OPA129
We are interested capturing EEG signals ( using ADS1299 ). Its said in the datasheet the input impedance is around 1Gohms. For our specific task we need to have more higher input impedance. Could we achieve it by adding a high impedance opamp like OPA129 in voltage follower configuration for differential analog input pins.
Thank you.
Part Number:BQ40Z50-R1
This is the first time for me to use bq40z50-r1. Considering my application, there are two things I don't understand, as follows:
1. How to write bq40z50-r1 battery ID?Is there any detailed operation procedure?
2. How to change protection parameters for bq40z50-r1?
Hope to get a reply, thank you!