Part Number:DAC5670-SP
Hi Support,
Currently, we plan to use DAC5670 and ADC12D1800.
However, due to the high power, we have to implement heat sink which sits on the top of the packages.
There will be a compressible force from the top of the chassis cover down to the thermal pad and package lid.
Our application is for Space Flight, therefore the normal heat sink with fins will not work since there is no air flow.
In the datasheets of both the parts, it is mentioned that heat sinks can be added on top of the package, but it is not mentioned how much pressure can be applied.
Will you be able to comment on the recommended pressure to apply so that the solder balls will not be damaged?
Thanks.