Hi,
I have a question about TCI6618 package.
From TCI6618 datasheet page.222,
it looks like that the package is made by 3 Layer.
Middle layer is smaller than top and bottom layer,
so there are space between top and bottom layer.
I am anxious about the durability of package.
Q1. When pressure is applied to a lid, can the package bear enough
from the pressure?
By the way, I have check the C6678EVM(which is same package as TCI6618).
Something is mounted in the four corners between top and bottom layer
which isn't written in datasheet. I will attach the file, so please take a look.
Q2. Is this mounting only for EVM or is it product specification?
Q3. Is it for preventing damaging, when pressure is added to top layer?
Q3. If this is correct, may I understand that it is satisfactory in durability?
best regards,
g.f.