We are having problems finding assembly houses that can competently assemble your DM3725CPBA cpu and memory onto a PCB. What are the technical assembly specifications, temperature ramp times and suggested assembly / integration procedures for this component?
Should the assembly / integration be a 2 step process? Should the cpu / memory be integrated separately before main PCB reflow?
Should the memory component then be staked to the DM3725 processor using a 2 step integration process using 2216 before main board assembly to prevent problems during main board reflow?
As It does not appear to be possible to discuss the difficulties with a human being, should we re-design with another vendor's component ?
Do you have a list of approved vendors that can assemble this configuration with 100% reliability?
Do you have a telephone number where I can discuss this issue with a REAL human being in REAL TIME?
IS there anybody at TI who still knows how to use a telephone?
We miss the old days when semiconductor companies had REAL technical support and not artificial internet "forget" and ignore support............
As usual, we will allow you 30 days to respond, then design a component using a competitor's part
Please advise.