Part Number: HDC2080
Hello,
I want to make sure I maximize the temperature response time of the HDC2080. I read both http://www.ti.com/lit/an/snoa967a/snoa967a.pdf and
From those documents I plan on using a two sided pcb and creating a heat island to decouple the HDC2080 thermally from the PCB. However, if I want to get a maximum response time it seems that creating a no solder mask copper pad connected to the DNP is the way to go. The copper pad would be exposed to the ambient air and thermally couple the air temperature directly to the DAP and on to the die. It would act as a large "temperature collector" of sorts due to the high thermal conductivity of copper.
Is this a good idea?
Regards,
Jason