TMP006 preferred layout details?

Hello--
TMP006 Layout and Assembly Guidelines (SBOU108) provides a lot of vital layout info...
but what I can't locate is the recommended BGA pad diameter.
Neither the datasheet nor the YZF package doc indicate this (by way of the device pad size
(which implies, at 1:1, the PCB pad size recommended in the MicroStar BGA doc)).

Scaling Figure 11 in the Guidelines to the 500um pitch and 150um traces, it *appears* that
the pads are 300um, but the image is pretty low-res.....  an actual value would help a lot.

Thanks!