Part Number: MSP430F5528
I used MSP430F5528IRGCT. After the existing ICs were opened, they were not consumed within the time limit and needed to be baked. After reviewing the JEDEC standard, I found the distinction between carrying high and low temperature carrier tapes. The details are as follows:
I would like to consult MSP430F5528IRGCT is the use of high temperature carrier tape or low temperature carrier tape? Can the carrier tape withstand several degrees of baking conditions?