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Sir,
I am working on a project based on CC2520. I have made two PCB designs, one is based on discrete inductors(1.2 nH made by Murata) and other one is based on chip balun (LDB182G4520C-110/ LDB1824510G-120 made by Murata) instead of the transmission line that is given in the datasheet of the CC2520. I have attached the layout design with this post.
Sir in the previous post (http://e2e.ti.com/support/low_power_rf/f/158/p/253172/887870.aspx#887870) you have suggested to ad more ground vias to stich the ground planes together and do not use thermal reliefs on the vias. According to your suggestion i have modified the design. Now please verify it will work or not. waiting for your valuable suggestion sir.