HDC2010: Manufacturing consistency of HDC2010 sensor

Part Number:HDC2010

Hi Team,

My customer has some confusions about HDC2010 as below:

1. the datasheet says [The sensing element of the HDC2010 is placed on the bottom part of the device, which makes the HDC2010 more robust against dirt, dust, and other environmental contaminants].

Is this the only reason that makes the sensing element be placed on the bottom part of the device? I note that the sensing element of HDC1080 is placed at the top of the device.

2. Due to the fact that the sensing element on the bottom, Is there a problem of  manufacturing consistency (Because the sensing part is on the bottom of device, the IC can't be tightly welded on the PCB, some place need to be reserved)?

Thanks a lot.

Loop in our customer.

Best regards,

Yang