Tool/software: TI C/C++ Compiler
Hi All
I saw "APBOND_LRU_BOND_REPLACEMENT" description in the document. (SWRU393_CC2640_BLE_Software_Developer's_Guide.pdf p.112)
(GAPBOND_LRU_BOND_REPLACEMENT parameter. If this parameter is set to false, it is not possible to add any more bonds without manually deleting a bond. If the parameter is set to true, the least recently used bond is deleted to make room for the new bond)
"least recently" ==> Less used will be erase bonding first.
Can I modify to erase bonding addr the oldest one?
Process：
GAP_BONDINGS_MAX=5
1、cc2640 connect with iphone 1 --> iphone 2 --> iphone 3 --> iphone 4 --> iphone 5
2、Connect/repair with iphone 6 (cc2640 erase iphone 1 bonding ) bonding list(old --> new) : iphone 2 --> iphone 3 --> iphone 4 --> iphone 5 --> iphone 6
3、Connect/repair with iphone 1 (cc2640 erase iphone 2 bonding ) bonding list(old --> new) : iphone 3 --> iphone 4 --> iphone 5 --> iphone 6 --> iphone 1
4、Connect/repair with iphone 2 (cc2640 erase iphone 3 bonding ) bonding list(old --> new) : iphone 4 --> iphone 5 --> iphone 6 --> iphone 1 --> iphone 2
5、Connect/repair with iphone 3 (cc2640 erase iphone 4 bonding ) bonding list(old --> new) : iphone 5 --> iphone 6 --> iphone 1 --> iphone 2 --> iphone 3
.........