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TM4C123GH6PM: JTAG interface

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Part Number:TM4C123GH6PM

Hi,

I am a bit confused with the JTAG interface's pull up/down resistors because it seems to be different depending on who you ask.

In TI's document: "Using TM4C12x Devices over JTAG interface"  (page 10) the ARM 10-Pin (Cortex Debug) Header is connected using this configuration:

TI's guide pull-up/donw in JTAG interface
TMSPull-Up (10K)
TCKPull-Up (10K)
TDOPull-Down (10K)
TDINone
RSTNone

(In this document, and only in the 10-Pin header case, there are also 33Ohms series resistors for all the lines but the RST)

But in the Tiva TM4C123G LaunchPad schematics from TI, they don't use the TDO pull-up, neither the 33Ohms resistors...  so what is it?

And if you search a little more you find other configurations:

In this NXP site they use a pull-down resistor for TCK and pull-up resistors for TDI and TDO, totally different from TI..

Xilinx uses only pull-ups in all the lines except the TDO that is left alone

I am using a TM4C123GH6PM microcontroller from TI so it seems safer to follow they design guidelines but it is surprising to find all this different configurations for something that should be an standard.

Even focusing in what TI suggest, what policy should I use? the one from the design guide or the one in the Tiva Launchpad schematics???

Thanks!


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