Part Number:ADC12D1600QML-SP
I am evaluating ADC12D1600CCMLS for use on a NASA mission that requires microcircuits to conform to EEE-INST-002 Level 1 (section M3). Although the ADC12D1600QML-SP part number family contains the term "QML", it does not have a 5962* part number so it's unclear which MIL-PRF-38535 QML class the flight part conforms to (if any). Therefore it is unclear what testing is performed for screening and qualification.
Screening: I need to know whether each test listed below is performed as a part of the standard screening flow for ADC12D1600CCMLS, and what test method [e.g. from MIL-STD-883] is used. I have seen the TI document called "Testing and Inspection of QML Class Q Ceramic Devices" which shows the screening flow diagram for Class M and Class B devices, but I haven't seen any documentation showing that ADC12D1600CCMLS conforms to the screening flow in that document. I need confirmation whether the tests listed below are performed on 100% of parts in every lot of ADC12D1600CCMLS parts. Hoping you could send me a sample screening traveler or a sample of a screening record that’s already been filled out for a past lot.
- Wafer lot acceptance
- Nondestructive bond pull
- Internal visual inspection
- Temperature Cycling
- Constant acceleration (e.g. centrifuge)
- PIND
- Radiographic inspection
- Serialization
- Initial Electrical measurements
- Burn-in
- Final electrical measurements
- Delta between initial and final electrical measurements
- Percent defective allowable (is there a limit for a manufactured lot?)
- Hermetic seal: Fine leak, Gross leak
- External visual
Qualification: TI technical support sent me a document called "FMQR New Package Qual ADC12D1620" which has some information. The document shows records of these qualification tests for ADC12D1600CCMLS:
- Resistance to solvents
- Bond strength
- Die attach strength (shear test)
- Solderability
- Life test, 1000 hours
I need to know whether these remaining EEE-INST-002 Level 1 qualification tests were ever done for qualification, and what test method [e.g. from MIL-STD-883] was used. Or perhaps are these done as screening tests as a lot-based qualification?
- Hermetic seal: Fine leak, Gross leak- Was ADC12D1600CCMLS perhaps qualified via a different part number’s package?
- Thermal Shock
- Temperature Cycling
- Moisture resistance - Was ADC12D1600CCMLS perhaps qualified via a different part number’s package?
- Shock
- Vibration
- Constant acceleration (e.g. centrifuge)
- Residual Gas Analysis and/or Internal Water Vapor - Was ADC12D1600CCMLS perhaps qualified via a different part number’s package?
- Adhesion of lead finish - Was ADC12D1600CCMLS perhaps qualified via a different part number’s package?
- Lid torque - Was ADC12D1600CCMLS perhaps qualified via a different part number’s package?